㈠Features：

ⅠChip Resistors in thick film technology   

ⅡAgPd termination (Silver-Palladium thick film) for flip chip assembly  (face-down; for conductive epoxy assembly or soldering)  

Ⅲ Gold termination (0402, 0603, 0805) for wire bonding (US/TC; face  -up) as well as flip chip (face-down; for conductive epoxy assembly 

ⅣHigh temperature application up to 200°C possible (CBW-HT) 

ⅤNo wrap-around 

ⅥBottom side completely insulated; passivation on resistor side from   1206 available 

Ⅶ Non-magnetic

㈡Power Rating:

   Power Rating: 50=50mW,100=100mW,125=125mW,250=250mW......

㈢Resistance Value:

100K0=100KΩ,100M0=100MΩ,1G100=1.1GΩ,10T00=10TΩ

㈣Tolerance:

    J=±5%,K=±10%,M=±20%

㈤T.C.R.:

±50ppm/℃,±100ppm/℃,±250ppm/℃